Substrate material is the fundamental material for manufacturing semiconductor components and printed circuit boards. The packaging substrate is an important component of electronic packaging and serves as a bridge between chips and external circuits. High performance ceramic substrates are the most fundamental materials in the chip and electronic packaging industry.
In recent years, the additive manufacturing industry based on 3D printing technology has made rapid progress and has gained more and more applications in the production of special and complex components. The basic raw material for metal 3D printing technology is metal powder with high sphericity and narrow particle size distribution. The basic process for the preparation and production of this powder is to melt the metal alloy and flow out through a nozzle (leak). At the nozzle outlet, high-pressure airflow is used to atomize the metal liquid, while cooling it into spherical particles. The nozzle material needs to have properties such as high temperature resistance, heat shock resistance, fine machining ability, and resistance to metal liquid corrosion. The company entered this field in 2015 and has now become a highly influential and shipping company in the industry!
Boron nitride ceramic is a material with good high-temperature insulation performance. When the temperature exceeds 1600 ℃, only boron nitride ceramic can perform well for a long time. In the high-temperature Vacuum furnace with carbon material as the heating element and carbon felt and graphite felt as the insulation material, the insulation between the heating electrode and the insulation structure is the key to the normal use of the equipment. Over 1600 ℃, boron nitride ceramics are the only insulating material. The company entered this field in 2009 and has a certain influence in the industry!
Fuzhou Ceravite New Materials Development Co.,Ltd.