(800×800 mm), designed for sintering large‑size silicon nitride and aluminum nitride substrates, and also suitable for sintering large‑size aluminum nitride electrostatic chucks.

Substrate material is the fundamental material for manufacturing semiconductor components and printed circuit boards. The packaging substrate is an important component of electronic packaging and serves as a bridge between chips and external circuits. High performance ceramic substrates are the most fundamental materials in the chip and electronic packaging industry.

Substrate material is the fundamental material for manufacturing semiconductor components and printed circuit boards. The packaging substrate is an important component of electronic packaging and serves as a bridge between chips and external circuits. High performance ceramic substrates are the most fundamental materials in the chip and electronic packaging industry.

Substrate material is the fundamental material for manufacturing semiconductor components and printed circuit boards. The packaging substrate is an important component of electronic packaging and serves as a bridge between chips and external circuits. High performance ceramic substrates are the most fundamental materials in the chip and electronic packaging industry.

High‑purity product with a purity exceeding 99.9% and an oxygen content below 0.06%, suitable for use as a stacked isolation layer on aluminum nitride and silicon nitride substrates, or for buried‑layer sintering applications.

Substrate material is the fundamental material for manufacturing semiconductor components and printed circuit boards. The packaging substrate is an important component of electronic packaging and serves as a bridge between chips and external circuits. High performance ceramic substrates are the most fundamental materials in the chip and electronic packaging industry.

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Fuzhou Ceravite New Materials Development Co.,Ltd.

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Tel:86-13799982018  (Mr. Chen)
E-mail: ccb@ceravite.com.cn

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